Reconfigurable modular computing device

ABSTRACT

A configurable computing device comprising a housing, a printed circuit board disposed within the housing, a first microcontroller and a second microcontroller each coupled to the PCB, wherein the first microcontroller and the second microcontroller are in electrical signal communication with each other, a computer-on-module (COM) coupled to the PCB, wherein the COM is in electrical signal communication with the first microcontroller and the second microcontroller, and one or more peripheral modules coupled to the PCB, wherein, the peripheral modules are each in electrical signal communication with the first microcontroller and wherein, the peripheral modules are each in electrical signal communication with the COM via the second microcontroller.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority to U.S. Provisional PatentApplication Nos. 61/644,243 filed May 8, 2012 by Douglas L. Fowler andentitled “Ultra Modular Device (UMD),” 61/711,878 filed Oct. 10, 2012 byDouglas L. Fowler and entitled “Odem™ Cross-Fire™,” and 61/774,916 filedMar. 8, 2013 by Douglas L. Fowler and entitled “Crossbow™ TabletComputer System,” which applications are incorporated herein byreference as if produced in their entirety.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

REFERENCE TO A MICROFICHE APPENDIX

Not applicable.

BACKGROUND

A computing device may generally comprise a plurality of functionalunits, peripheral connections, and user interfaces, for example, one ormore memory storage devices, microprocessors, audio/video processors,display screens, input/output ports, etc. As such, conventionalcomputing device may have a preconfigured set of functional units,peripheral connections, and user interfaces for a given application. Forexample, the computing device may be configured for meeting computingperformance metrics, for harsh elemental environments, for extremetemperatures, for portability, for integration, for high security,and/or for any other application. Conventional computing devices,systems, and configurations are insufficient to provide the ability toaccommodate for a broad range of applications with a single computingdevice. As such, devices, systems, and methods for allowing a computingdevice to be employed in a broad range of applications are needed.

SUMMARY

In one aspect, the disclosure includes a configurable computing devicecomprising a housing, a printed circuit board disposed within thehousing, a first microcontroller and a second microcontroller eachcoupled to the PCB, wherein the first microcontroller and the secondmicrocontroller are in electrical signal communication with each other,a computer-on-module (COM) coupled to the PCB, wherein the COM is inelectrical signal communication with the first microcontroller and thesecond microcontroller, and one or more peripheral modules coupled tothe PCB, wherein, the peripheral modules are each in electrical signalcommunication with the first microcontroller and wherein, the peripheralmodules are each in electrical signal communication with the COM via thesecond microcontroller.

In another aspect this disclosure includes a computing device methodcomprising the steps of providing a printed circuit board (PCB)comprising a first microcontroller and a second microcontroller, whereinthe first microcontroller and the second microcontroller are inelectrical signal communication with each other, installing acomputer-on-module (COM) to the PCB, wherein the COM is electricallycoupled to the PCB, interrogating the COM, thereby determining a COMprofile, installing one or more peripheral modules to the PCB, whereinthe peripherals are each electrically coupled to the PCB, interrogatingthe peripheral modules, thereby determining a peripheral module profile,configuring the second microcontroller, wherein, the secondmicrocontroller is configured dependent on the COM profile and theperipheral module profile and provides one or more electrical signalflow paths between the COM and the peripheral modules, and communicatingan electrical signal between the COM and the peripheral modules via thesecond microcontroller.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure and theadvantages thereof, reference is now made to the following briefdescription, taken in connection with the accompanying drawings anddetailed description:

FIG. 1 is a schematic diagram of an embodiment of a configurablecomputing device;

FIG. 2 is a partial block diagram of embodiment of a configurablecomputing device;

FIG. 3 is a block diagram of an embodiment of a configurable computingdevice;

FIG. 4 is an rear-side perspective exploded view of an embodiment of ahousing;

FIG. 5 is a front exploded view of an embodiment of a housing;

FIG. 6 is a rear exploded view of an embodiment of a housing;

FIG. 7 is a flowchart of an embodiment of a computing device configuringmethod;

FIG. 8 is a schematic diagram of an embodiment of a configurablecomputing device and a docking station; and

FIG. 9 is a schematic diagram of another embodiment of a configurablecomputing device and a docking station.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the drawings and description that follow, like parts are typicallymarked throughout the specification and drawings with the same referencenumerals, respectively. In addition, similar reference numerals mayrefer to similar components in different embodiments disclosed herein.The drawing figures are not necessarily to scale. Certain features ofthe invention may be shown exaggerated in scale or in somewhat schematicform and some details of conventional elements may not be shown in theinterest of clarity and conciseness. The present invention issusceptible to embodiments of different forms. Specific embodiments aredescribed in detail and are shown in the drawings, with theunderstanding that the present disclosure is not intended to limit theinvention to the embodiments illustrated and described herein. It is tobe fully recognized that the different teachings of the embodimentsdiscussed herein may be employed separately or in any suitablecombination to produce desired results.

Unless otherwise specified, use of the terms “connect,” “engage,”“couple,” “attach,” or any other like term describing an interactionbetween elements is not meant to limit the interaction to directinteraction between the elements and may also include indirectinteraction between the elements described.

Disclosed herein are embodiments of a reconfigurable modular computingdevice (RMCD) and methods of using the same. In an embodiment, a RMCDmay be utilized to allow a user to configure and/or to reconfigure theRMCD for one or more applications, as needed, thereby providing theability to configure the RMCD for a variety of applications. Forexample, the RMCD may be configured for a first application (e.g.,comprising a first set of functional units, peripheral connections, anduser interfaces) and then may be reconfigured for a second application(e.g., comprising a second set of functional units, peripheralconnections, and user interfaces), thereby providing the ability toadapt the RMCD for a given application.

The RMCD may comprise a plurality of functional units. In an embodiment,a functional unit (e.g., an integrated circuit (IC)) may perform asingle function, for example, serving as an amplifier or a buffer.Additionally or alternatively, the functional unit may perform multiplefunctions on a single chip. In an embodiment, the functional unit maycomprise a group of components (e.g., transistors, resistors,capacitors, diodes, and/or inductors) on an IC which may perform adefined function. The functional unit may comprise a specific set ofinputs, a specific set of outputs, and an interface (e.g., an electricalinterface, a logic interface, and/or other interfaces) with otherfunctional units of the IC and/or with external components. In someembodiments, the functional unit may comprise repeat instances of asingle function (e.g., multiple flip-flops or adders on a single chip)or may comprise two or more different types of functional units whichmay together provide the functional unit with its overall functionality.For example, a microprocessor may comprise functional units such as anarithmetic logic unit (ALU), one or more floating-point units (FPU), oneor more load or store units, one or more branch prediction units, one ormore memory controllers, and other such modules. In some embodiments,the functional unit may be further subdivided into component functionalunits. For example, a microprocessor as a whole may be viewed as afunctional unit of an IC, for example, if the microprocessor shares acircuit with at least one other functional unit (e.g., a cache memoryunit).

The functional unit may comprise, for example, a general purposeprocessor, a mathematical processor, a state machine, a digital signalprocessor, a video processor, an audio processor, a logic unit, a logicelement, a multiplexer, a demultiplexer, a switching unit, a switchingelement an input/output (I/O) element, a peripheral controller, a bus, abus controller, a register, a combinatorial logic element, a storageunit, a programmable logic device, a memory unit, a neural network, asensing circuit, a control circuit, a digital to analog converter (DAC),an analog to digital converter (ADC), an oscillator, a memory, a filter,an amplifier, a mixer, a modulator, a demodulator, and/or any othersuitable devices as would be appreciated by one of ordinary skill in theart.

Referring to the embodiment of FIG. 1, a RMCD 100 may comprise aplurality of distributed components and/or functional units such thateach functional unit may communicate with another functional unit via asuitable signal conduit, for example, via one or more electricalconnections, as will be disclosed herein. For example, the RMCD 100 maygenerally comprise a printed circuit board (PCB) 102, a firstmicrocontroller 104, a second microcontroller 106, a computer-on-module(COM) or system-on-module (SOM) 108, and one or more embedded orperipheral modules 110.

In an embodiment, the PCB 102 may be configured to provide physical andelectrical connectivity between one or more functional units, forexample, between one or more microcontrollers, between one or moreperipheral modules, between a microcontroller and one or more peripheralmodules, etc. The PCB 102 may generally comprise a non-conductivesubstrate having a plurality of conductive flow paths, tracks, traces,or the like, and thereby provides a plurality of routes for electricalsignal communication. In an embodiment, the PCB 102 may comprise aplurality of preconfigured electrical signal flow paths (e.g., one ormore conductive electrical signal flow paths etched onto the PCB 102)and a plurality of configurable electrical signal flow paths (e.g., oneor more electronically switchable electrical signal flow paths, forexample, via one or more transistors, microprocessors, etc.), as will bedisclosed herein.

In an embodiment, the first microcontroller 104 and/or the secondmicrocontroller 106 may be a peripheral interface controller (PIC), afield programmable gate array (FPGA), or an embedded processor and maygenerally comprise an ALU, one or more data registers, an ADC, one ormore memory devices, a plurality of input/output (I/O) ports, a matrixswitch, one or more signal conditioners or adapters, any other suitablefunctional unit as would be appreciated by one of ordinary skill in theart upon viewing this disclosure, or combination thereof. The firstmicrocontroller 104 and/or the second microcontroller 106 may beconfigured to selectively provide one or more electrical signal flowpaths, for example, via one or more I/O ports. In an embodiment, thefirst microcontroller 104 and/or the second microcontroller 106 may beconfigured to communicate an electrical signal to a plurality of I/Oports (e.g., a controller area network (CAN) bus, an Inter-IntegratedCircuit (I²C) bus, a Universal Serial Bus (USB), a low pin count (LPC)bus, a Universal Asychronous Receiver/Transmitter (UART) bus, a lowvoltage differential signaling (LVDS) bus, etc.) and to employ anysuitable signaling protocol as would be appreciated by one of ordinaryskill in the art upon viewing this disclosure. For example, the firstmicrocontroller 104 and/or the second microcontroller 106 may comprise amemory device having instructions to allow and/or to disallow one ormore electrical signal flow paths (e.g., via one or more I/O ports) inresponse to a data signal (e.g., a device profile), as will be disclosedherein.

In an embodiment, the first microcontroller 104 and the secondmicrocontroller 106 each comprise an electronic circuit configured toperform logical and/or arithmetic operations. Additionally, the firstmicrocontroller 104 and/or the second microcontroller 106 may furthercomprise a memory storage device (e.g., an electrically erasableprogrammable read-only memory (EEPROM), an erasable programmableread-only memory (EPROM), a read-only memory (ROM), etc.) having asystem basic input/output system (BIOS), a board support package (BSP),an operating system, a look-up table, a firmware, a driver, datainstructions, or the like programmed onto the first microcontroller 104and/or the second microcontroller 106, for example, for the purpose ofperforming one or more operations (e.g., detecting hardware, configuringI/O ports, performing an authentication, performing a verification,etc.). For example, the first microcontroller 104 may comprise a memoryhaving start-up instructions, such as, reading a temperature sensor,initializing general purpose input/output (GPIO) ports, and enablingpower flow (e.g., to a COM, one or more peripheral devices, etc.).

Additionally, the first microcontroller 104 and the secondmicrocontroller 106 are configured to control the flow of data throughthe RMCD 100 and/or to coordinate the activities of one or morefunctional units of the RMCD 100. For example, the first microcontroller104 and/or the second microcontroller 106 may be in electrical signalcommunication with and/or configured to control signal communications(e.g., data transmission) between the first microcontroller 104, thesecond microcontroller 106, the COM 108, the peripheral modules 110, anyother suitable functional units, or combinations thereof. In anembodiment, the second microcontroller 106 may comprise a memory havinga plurality of predefined I/O port configurations for a particulardevice (e.g., a COM, a peripheral module, etc.) and, thereby allowingthe second microcontroller 106 to configure, monitor, police, etc.electrical signal communication via the second microcontroller 106.

In the embodiment of FIG. 1, the first microcontroller 104 is inelectrical signal communication with the second microcontroller 106(e.g., via electrical connection 150), the COM 108 (e.g., via electricalconnection 152), the peripheral modules 110 (e.g., via electricalconnection 156). Additionally, the second microcontroller 106 is inelectrical signal communication with the COM 108 (e.g., via electricalconnection 154) and the peripheral modules 110 (e.g., via electricalconnection 158). Further, the RMCD 100 (e.g., first microcontroller 104and/or the second microcontroller 106) may comprise a power managementsystem, for example, comprising one or more voltage regulators, powerdistribution networks, voltage level converters, voltage rectifiers,etc. Additionally, the RMCD 100 may be supplied with electrical powervia a power source, for example, via an on-board battery, an alternatingcurrent (AC) power supply, a direct current (DC) power supply, etc. Forexample, the RMCD 100 may be supplied power via a 12 volt wall adapterpower supply.

Additionally, the first microcontroller 104 and/or the secondmicrocontroller 106 may be configured to be removably coupled to the PCB102. In such an embodiment, the first microcontroller 104 and/or thesecond microcontroller 106 may each be added to or removed from the PCB102, for example, for programming purposes, as needed. For example, thefirst microcontroller 104 and/or the second microcontroller 106 may becoupled to a carrier board or baseboard having a peripheral connectionbus (e.g., a plug-and-play device, a PCB comprising a plurality ofelectrical pins or contacts, etc.) and may be configured to couple withthe PCB 102 via mating the peripheral connection bus of the firstmicrocontroller 104 and/or the second microcontroller 106 to a suitableperipheral connection bus receiver on the PCB 102. In an embodiment, thefirst microcontroller 104 is a PIC24 family microcontroller.Additionally, the second microcontroller 106 is a Texas InstrumentsMSP430 family microcontroller. Alternatively, the first microcontroller104 and/or the second microcontroller 106 may be any other suitablemicrocontroller as would be appreciated by one of ordinary skill in theart upon viewing this disclosure.

In an embodiment, the COM 108 may be configured to be removably coupledto the PCB 102. For example, the COM 108 may be added to or removed fromthe PCB 102, for example, for the purpose of configuring orreconfiguring the RMCD 100 for a given application. For example, the COM108 may comprise a carrier board or baseboard having a peripheralconnection bus (e.g., a Qseven module, an ITX, a PC-104, a COM expressmodule, a plug-and-play device, a custom PCB comprising a plurality ofelectrical pins or contacts, etc.) and may be configured to couple withthe PCB 102 via mating the peripheral connection bus of the COM 108 to asuitable peripheral connection bus receiver on the PCB 102.

In an embodiment, the COM 108 may generally comprise a centralprocessing unit (CPU) or system-on-chip (SOC) (e.g., Intel Atom series,Freescale series, Texas Instruments OMAP series, etc.), a hubcontroller, a power management module, a memory device (e.g., a randomaccess memory (RAM), a read only memory (ROM), a flash memory, a cache,etc.), a plurality of I/O ports (e.g., a PCIe bus, a CAN bus, an I²Cbus, a USB, a LPC bus, a UART bus, a LVDS bus, a DisplayPort, etc.), anaudio processor, a video processor, a multi-band radio module, any othersuitable functional unit, or combination thereof. The COM 108 may beconfigured to support and/or to execute one or more instruction sets,for example, an X86 instruction set (e.g., an x86 platform) or BIOS, anARM instruction set (e.g., an ARM platform) or BSP, etc. Additionally,the COM 108 may be configured to support and/to execute one or moreoperating systems (OS), for example, a Windows-based OS, a Linux-basedOS, an Android-based OS, or the like. In an embodiment, the COM 108 isan x86 platform CPU. In an alternative embodiment, the COM 108 is an ARMplatform CPU. Additionally, in an embodiment, the COM 108 is integratedonto a Qseven module or board.

In an embodiment, the one or more peripheral modules 110 may beconfigured to be removably coupled to the PCB 102. For example, in anembodiment, the one or more peripheral modules 110 may be added to orremoved from the PCB 102, for example, for the purpose of configuring orreconfiguring the RMCD 100 for a given application. For example, theperipheral modules 110 may each comprise a carrier board or baseboardhaving a peripheral connection bus (e.g., a plug-and-play device, a PCBcomprising a plurality of electrical pins or contacts, etc.) and may beconfigured to couple with the PCB 102 via mating the peripheralconnection bus of the peripheral module 110 to a suitable peripheralconnection bus receiver on the PCB 102.

In an embodiment, the peripheral modules 110 may be generally configuredto provide increased functionality to the RMCD 100. For example, theperipheral modules 110 may comprise a display module, for example, aliquid crystal display (LCD), a light emitting diode (LED) display, anorganic light emitting diode (OLED) display, an active-matrix organiclight emitting diode (AMOLED) display, a color super twisted nematic(CSTN) display, a thin film transistor (TFT) display, a thin film diode(TFD) display, and/or any other suitable type of display as would beappreciated by one of ordinary skill in the art upon viewing thisdisclosure. Additionally or alternatively, the peripheral modules 110may comprise one or more user interfaces, for example, a capacitivetouchscreen, a resistive touchscreen, an inductive digitizer, a key pad,a mouse pad, a track ball, one or more buttons, any other suitable humaninput devices as would be appreciated by one of ordinary skill in theart upon viewing this disclosure, or combinations thereof. Additionallyor alternatively, the peripheral modules 110 may comprise one or moresensors or cameras, for example, a CMOS imager module, a barcode module,a near field card reader module, a magnetic card reader module, a radiofrequency identification (RFID) module, a biometric sensor module, alight detector module, a camera flash module, a global position system(GPS) module, a bedside monitor module, an accelerometer module, agyroscope module, and/or any other suitable type of sensor or cameramodule as would be appreciated by one of ordinary skill in the art uponviewing this disclosure. Additionally or alternatively, the peripheralmodules 110 may comprise one or more audio modules, for example, aspeaker or a microphone. Additionally or alternatively, the peripheralmodules 110 may comprise one or more communications or connectivitymodules, for example, an ethernet module, a WiFi module, a radio module,a cellular radio module, an antenna, a multi-band antenna, a Bluetoothmodule, an infrared module, near filed communications module (NFC),and/or any other suitable type of communications or connectivity moduleas would be appreciated by one of ordinary skill in the art upon viewingthis disclosure. Additionally or alternatively, the peripheral modules110 may comprise one or more I/O connection modules, for example, anHDMI module, a RS-223 module, a USB module, a DVI module, a VGA module,an S-video module, a docking port interface module, and/or any othersuitable type of I/O connection module. Additionally or alternatively,the peripheral modules 110 may comprise a power supply module, forexample, a battery pack module. Additionally or alternatively, theperipheral modules 110 may comprise one or more military or securitymodules, for example, a common access card (CAC) reader module, a secureradio modem module, a selective availability GPS module, anencryption/decryption module, a SAASM/TacLink expansion module (STEM),and/or any other suitable military module. For example, in anembodiment, the peripheral modules 110 may comprise a STEM modulecomprising a military microgram GPS receiver with an embedded antennaand a secure TacLink 3300 data modem. Additionally or alternatively, theperipheral modules 110 may comprise any other suitable type and/orconfiguration of peripheral modules as would be appreciated by one ofordinary skill in the art upon viewing this disclosure.

The one or more peripheral modules 110 may be configured to communicatewith the first microcontroller 104 and/or the second microcontroller 106via any suitable electrical signal protocol (e.g., a protocol defined bythe Institute of Electrical and Electronics Engineers (IEEE)) as wouldbe appreciated by one of ordinary skill in the art upon viewing thisdisclosure.

Referring to FIGS. 2-3, an embodiment of the RMCD 100 is illustrated. Insuch an embodiment, the first microcontroller 104 is a peripheralinterface controller (PIC) and is integrated with the PCB 102 (e.g.,shown as a main logic board (MLB)) and in electrical communication witha plurality of on-board devices and peripheral connections associatedwith the PCB 102 (e.g., sensors, I/O ports, etc.). For example, in theembodiment of FIG. 2, the first microcontroller 104 is in electricalsignal communication with a plurality of connection buses (e.g., a COMconnection bus 120, an on-demand expansion module (ODEM) connection bus122, super I/O bus, etc.), sensors (e.g., compass, accelerometer,thermometer, etc.), I/O ports (e.g., a CAN bus, an I²C bus, a USB, a LPCbus, a UART bus, etc.), peripheral modules (e.g., user interface module110 a, I/O module 110 b, etc.), and any other component or deviceassociated with the PCB 102. Referring to FIG. 3, the secondmicrocontroller 106, shown as ODEM module, is coupled to a carrier boardhaving a peripheral connection bus (e.g., a plug-and-play device, acustom PCB comprising a plurality of electrical pins or contacts, etc.)and is coupled with the PCB 102 (e.g., MLB) via the peripheralconnection bus receiver (e.g., the ODEM connection bus 122). The COM 108may comprise a carrier board having a peripheral connection bus (e.g., aQseven module, a plug-and-play device, a PCB comprising a plurality ofelectrical pins or contacts, etc.) and is coupled with the PCB 102 viathe peripheral connection bus receiver (e.g., connection bus 120).Further, the PCB 102 is coupled to a plurality of peripheral modules.For example, the PCB 102 is coupled to a user interface (UI) module 110a having a plurality of buttons (e.g., a reset button, a power button,etc.) and I/O ports (e.g., a power terminal, a USB port, a headphonejack, etc.) via a connection bus 126, a I/O module 110 b having aplurality of buttons and a I/O ports (e.g., a USB port, an HDMI port, amemory port, etc.), a radio module 110 d (e.g., a multi-radio card), anda memory module 110 c (e.g., a Mini-SATA).

Referring to FIGS. 4-6, the RMCD 100 may be disposed within a housing oran enclosure 500 which may be configured to protect the RMCD 100.Additionally, the housing 500 may provide a means for transporting theRMCD 100 and/or for integrating the RMCD 100 with other structures ordevices. For example, the housing 500 may be configured to be mounted onand/or integrated with, for example, a wall mount, a flush mount, adesktop mount, a stand, a mobile dock, a docking station (e.g., via adocking connector 514), a bumper guard 512, or the like.

In an embodiment, the housing may be made of two or more operablyconnected components (e.g., a front case 502, a mid-frame 504, and aback case 506). For example, RMCD 100 may be coupled to the mid-frame504 (e.g., via the PCB 102) and enclosed by the front case 502 and theback case 506. Alternatively, the housing may comprise any suitableenclosure structure as will be appreciated by one of ordinary skill inthe art with the aid of this disclosure. Further, the housing maycomprise one or more mounting surfaces, recesses, and/or openings, forexample, for the purpose of mounting one or more components of the RMCD100 (e.g., the PCB 102, one or more peripherals 110, etc.). For example,in the embodiment of FIG. 5, the housing 500 may be configured to mountor support a user interface module 110 a and an I/O module 110 b. Thehousing 500 may be configured to integrate one or more add-on orexpansion modules (e.g., a battery pack 518, a heat spreader 510, etc.).For example, in the embodiment of FIG. 6, an expansion module 516 may beintegrated with the housing 500 and RMCD 100 via an expansion connector508. As such, the housing may be made of conventional materials andmethods as would be appreciated by one of ordinary skill in the art.

In an embodiment, the RMCD 100 may further comprise one or more thermalprovisions. For example, the RMCD 100 may comprise one or more passivethermal provision (e.g., a heat spreader, a heat sink, a heat pipe, avent, etc.) and/or one or more active thermal provisions (e.g., a fan, aforced air system, a hydraulic system, a cryogenic cooling system,etc.). In such an embodiment, the thermal provisions may extend theoperating temperature range (e.g., allowing a higher operatingtemperature and/or a lower operating temperature) beyond that which isachievable without such thermal provisions. For example, the RMCD 100may comprise a forced air system (e.g., an electric fan) in electricalsignal communication with the first microcontroller 104 and/or thesecond microcontroller 106 and may be configured to be controlled and/oroperated by the first microcontroller 104 and/or the secondmicrocontroller 106.

In an embodiment, a method of configuring a computing device utilizing aRMCD is disclosed herein. As illustrated in FIG. 7, a computing deviceconfiguring method 300 may generally comprise the steps of providing aPCB (e.g., the MLB of FIG. 3) comprising a first microcontroller (e.g.,the PIC of MLB of FIG. 3) and a second microcontroller (e.g., the ODEMmodule of FIG. 3) 302, coupling a COM (e.g., the COM of FIG. 3) to thePCB 304, interrogating the COM 306, coupling one or more peripheralmodules (e.g., UI module and I/O module of FIG. 3) to the PCB 308,interrogating the peripheral modules 310, configuring the secondmicrocontroller 312, and communicating an electrical signal between theCOM and the peripheral modules via the second microcontroller 314.

Optionally, the computing device configuring method 300 may furthercomprise decoupling the COM from the PCB 102, coupling a second COM tothe PCB 102, interrogating the second COM, configuring the secondmicrocontroller 106, and communicating an electrical signal between thesecond COM and the peripheral modules 110. Additionally or alternative,the computing device configuring method 300 may further comprisereconfiguring the peripheral modules 110, interrogating the peripheralmodules 110, configuring the second microcontroller 106, andcommunicating an electrical signal between the COM and the peripheralmodules 110. Additionally or alternatively, the computing deviceconfiguring method 300 may further comprise providing a docking station,interrogating the docking station, configuring the secondmicrocontroller 106, and communicating an electrical signal between theCOM and the docking station.

Referring to FIG. 8, the PCB 102 may be provided comprising the firstmicrocontroller 104 and the second microcontroller 106. For example, thePCB 102 may be coupled to and/or disposed within the housing 500, forexample, the PCB 102 is mounted to a mid-frame 504 within the housing500, as shown in FIG. 4. In an embodiment, the first microcontroller 104and/or the second microcontroller 106 may be installed onto the PCB 102,for example, following mounting the PCB 102 to the housing 500. Forexample, where the second microcontroller 106 is coupled to a carrierboard (e.g., a PCB have a plurality of electrical contacts), the secondmicrocontroller 106 may be installed into a suitable receiver port(e.g., a peripheral connection bus) on the PCB 102. Alternatively, thefirst microcontroller 104 and/or the second microcontroller 106 may behard-wired (e.g., soldered) to a plurality of electrical traces on thePCB 102. Additionally, when providing the PCB 102 comprising the firstmicrocontroller 104 and the second microcontroller 106, the firstmicrocontroller 104 and/or the second microcontroller 106 may beprogrammed or reprogrammed with data and/or device settingconfigurations, for example, to provide a default device configurationand/or logical operations. For example, one or more I/O ports may beconfigured, a firmware may be installed, a driver may be installed, aBIOS may be configured, and/or any other suitable configurationoperation may be performed as would be appreciated by one of ordinaryskill in the art upon viewing this disclosure.

In an embodiment, a COM 108 may be provided and installed or coupledonto the PCB 102. For example, the COM 108 may be determined and/orconfigured for a desired application, for example, the COM 108 maycomprise a preset operating system, CPU, chipset, etc. Where the COM 108comprises a carrier board (e.g., a PCB have a plurality of electricalcontacts), the COM 108 may be installed into a suitable receiver port(e.g., a peripheral connection bus) on the PCB 102, thereby providing aroute of electrical signal communication between the COM 108 and thefirst microcontroller 104 and the COM 108 and the second microcontroller106.

In an embodiment, following the coupling of the COM 108 to the PCB 102,the first microcontroller 104 and/or the second microcontroller 106 mayinterrogate the COM 108, for example, via the I/O ports (e.g., I²C, LPC,UART, etc.) and employing any suitable protocol and/or method as wouldbe appreciated by one of ordinary skill in the art upon viewing thisdisclosure. For example, the first microcontroller 104 and/or the secondmicrocontroller 106 may employ a hardware detection protocol (e.g., aplug-and-play protocol) to detect the presence of the COM 108, forexample, via an OS, a firmware, a driver, or data instructionsprogrammed onto the first microcontroller 104 and/or the secondmicrocontroller 106. Additionally, upon detecting the presence of theCOM 108, the first microcontroller 104 and/or the second microcontroller106 may generate or determine a COM profile. The COM profile maygenerally comprise device information, device configuration parameters,and/or device settings, etc. based on the detected COM 108. For example,the COM profile may comprise CPU information (e.g., Intel Atom E780T,Freescale iMX6, etc.), chip set information, clock speed information, OSinformation, manufacturing information, security key encryption, or anyother suitable information for distinguishing and/or describing a COM aswould be appreciated by one of ordinary skill in the art upon viewingthis disclosure.

In an embodiment, one or more peripheral modules 110 may be provided andinstalled or coupled onto the PCB 102. For example, the peripheralmodules 110 may be determined and/or configured for a desiredapplication. For example, the peripheral modules 110 may comprise one ormore user interface modules (e.g., a display, a keypad, a touchscreen,etc.), one or more I/O modules (e.g., a HDMI module, a USB module, a VGAmodule, etc.), and/or any other suitable module as would be appreciatedby one of ordinary skill in the art upon viewing this disclosure. Theperipheral modules 110 may be installed into a suitable receiver port(e.g., a peripheral connection bus) on the PCB 102, thereby providing aroute of electrical signal communication between the peripheral modules110 and the first microcontroller 104 and the peripheral modules 110 andthe second microcontroller 106.

In an embodiment, following the coupling of the peripheral modules 110to the PCB 102, the first microcontroller 104 and/or the secondmicrocontroller 106 may interrogate each of the peripheral modules 110.For example, the first microcontroller 104 and/or the secondmicrocontroller 106 may employ a hardware detection protocol (e.g., aplug-and-play protocol) to detect the presence of each peripheral module110, for example, via an OS, a firmware, a driver, or data instructionsprogrammed onto the first microcontroller 104 and/or the secondmicrocontroller 106. Additionally, upon detecting the presence of theperipheral modules 110, the first microcontroller 104 and/or the secondmicrocontroller 106 may generate or determine a peripheral moduleprofile. The peripheral module profile may generally comprise deviceinformation, device configuration parameters, and/or device settings,etc. based on the detected peripheral modules 110.

In an embodiment, the second microcontroller 106 may provide one or moreelectrical signal flow paths in response to the COM profile and/or theperipheral module profile. For example, one or more I/O ports of thesecond microcontroller 106 may be configured and/or reconfigureddependent on the COM 108 and/or the peripheral modules 110 coupled tothe PCB 102 (e.g., based on the COM profile and/or the peripheral moduleprofile), thereby allowing and/or disallowing one or more electricalsignal flow paths between the COM 108 and the peripheral modules 110 viathe second microcontroller 106.

In an embodiment, the second microcontroller 106 comprises a memoryhaving a look-up table relating a plurality of predefined I/O portconfigurations with a particular device (e.g., a COM, a peripheralmodule, etc.). For example, following detecting a device coupled to thePCB 102, the second microcontroller 106 may determine the profile of thedevice (e.g., via the COM profile, the peripheral module profile, etc.)and may employ a predefined I/O port configuration associated with thedetected device, thereby routing an electrical signal flow path andenabling electrical signal communication to the device via the secondmicrocontroller 106. In an additional or alternative embodiment, thesecond microcontroller 106 may comprise and/or is coupled to a pluralityof electronically switchable gates (e.g., a matrix switch, a gate array,etc.) and implement predefined switch configurations associated with thedetected device, thereby routing an electrical signal flow path andenabling electrical signal communication to the device via the secondmicrocontroller 106. Additionally, the second microcontroller 106 maydetermine (e.g., via the COM profile, the peripheral module profile,etc.) and allow the appropriate protocols and/or signaling to beperformed based on the detected device. Alternatively, any suitablepassive or active methods or techniques may be employed to configure theI/O ports of the second microcontroller 106 in response to a particulardevice, as would be appreciated by one of ordinary skill in the art uponviewing this disclosure.

In an embodiment, upon establishing one or more electrical signal flowpaths via the second microcontroller 106, the COM 108 may communicate anelectrical signal (e.g., a data signal) to/from the peripheral modules110 via the electrical signal flow paths enabled by the secondmicrocontroller 106. For example, the peripheral modules 110 maycomprise a display (e.g., a LCD screen, a LED screen, etc.) and the COM108 may display graphical data on the display. Additionally oralternatively, the peripheral modules 110 may comprise a plurality ofI/O port modules (e.g., a USB module, an HDMI module, etc.) and the COM108 may transfer data to/from the I/O port modules via the electricalsignal flow paths enabled by the second microcontroller 106.Additionally or alternatively, the peripheral modules 110 may comprise auser interface module (e.g., a keypad, a touch screen, etc.) and the COM108 may receive commands from a user via the user interface module viathe electrical signal flow paths enabled by the second microcontroller106. Additionally or alternatively, the peripheral modules 110 maycomprise a sensor module (e.g., a camera, a RFID module, etc.) and theCOM 108 may receiver sensor data from the sensor module via theelectrical signal flow paths enabled by the second microcontroller 106.Additionally or alternatively, the peripheral modules 110 may comprise acommunications module (e.g., a WiFi module, a cellular radio module,etc.) and the COM 108 may transmit and receive data via thecommunications module via the electrical signal flow paths enabled bythe second microcontroller 106. Additionally or alternatively, the COM108 may employ or communicate with any other suitable peripheral module110 via the electrical signal flow paths enabled by the secondmicrocontroller 106, as would be appreciated by one of ordinary skill inthe art upon viewing this disclosure.

In an embodiment, the RMCD 100 may be reconfigured and the COM 108 maybe replaced and/or removed from the PCB 102. For example, the COM 108may be decoupled from the PCB 102, for example, via removing the COM 108from a peripheral connection bus on the PCB 102. A second COM may beprovided and installed onto or coupled to the PCB 102, for example,using the same connection and footprint as the COM 108. The second COMmay be determined and/or configured (e.g., a preset operating system,CPU, chipset, etc.) for a desired application. In an embodiment, thesecond COM is different from the COM 108 (e.g., a change from a x86 COMplatform to an ARM COM platform). In an alternative embodiment, thesecond COM is a new or updated version of the COM 108 (e.g., an x86 orARM COM platform update, for example, an updated CPU, chip set, etc.).

The second COM may be installed into a suitable receiver port (e.g., aperipheral connection bus) on the PCB 102. The first microcontroller 104and/or the second microcontroller 106 may interrogate the second COM togenerate or determine a COM profile based on the second COM, similar topreviously disclosed. Additionally, one or more I/O ports of the secondmicrocontroller 106 may be configured and/or reconfigured dependent onthe second COM coupled to the PCB 102 (e.g., based on the COM profile),thereby allowing and/or disallowing one or more electrical signal flowpaths between the second COM and the peripheral modules 100 via thesecond microcontroller 106. Upon establishing one or more electricalsignal flow paths via the second microcontroller 106, the second COM maycommunicate an electrical signal (e.g., a data signal) to/from theperipheral modules 110 via the electrical signal flow paths enabled bythe second microcontroller 106.

In an embodiment, the RMCD 100 may be reconfigured and one or moreperipheral modules may be replaced and/or removed from the PCB 102. Forexample, one or more peripheral modules (e.g., the UI module 110 aand/or the I/O module 110 b of FIG. 3) may be decoupled from the PCB102, for example, via removing the peripheral module from a peripheralconnection bus on the PCB 102. In an embodiment, one or more additionaland/or different peripheral modules may be provided and installed orcoupled onto the PCB 102. The peripheral modules may be determinedand/or configured for a desired application. The first microcontroller104 and/or the second microcontroller 106 may interrogate the peripheralmodules to generate or determine a peripheral module profile based onthe peripheral modules coupled to the PCB 102, similar to previouslydisclosed. Additionally, one or more I/O ports of the secondmicrocontroller 106 may be configured and/or reconfigured dependent onthe peripheral modules coupled to the PCB 102 (e.g., based on theperipheral module profile), thereby allowing and/or disallowing one ormore electrical signal flow paths between the COM 108 and the peripheralmodules via the second microcontroller 106. Upon establishing one ormore electrical signal flow paths via the second microcontroller 106,the COM 108 may communicate an electrical signal (e.g., a data signal)to/from the peripheral modules via the electrical signal flow pathsenabled by the second microcontroller 106.

In an embodiment, the RMCD 100 may be coupled to or integrated with adocking station 200. For example, in the embodiment of FIG. 8, thedocking station 200 may comprise a third microcontroller 112 inelectrical signal communication with one or more dock peripheral modules114 (e.g., one or more user interface modules, one or more I/O modules,etc.), for example, via electrical connection 162. The RMCD 100 may bephysically and/or electrically coupled to the docking station 200, forexample, the housing of the RMCD 100 may be supported by the dockingstation 200 and the RMCD 100 may be in electrical signal communicationwith the docking station 200 via an electrical connection 160. The firstmicrocontroller 104 and/or the second microcontroller 106 mayinterrogate the docking station 200 (e.g., the third microcontroller 112and/or the dock peripherals 114) to generate or determine a dockingstation profile based on the docking station 200, similar to previouslydisclosed. Additionally, in an embodiment, one or more I/O ports of thesecond microcontroller 106 may be configured and/or reconfigureddependent on the docking station 200 coupled to the RMCD 100 (e.g.,based on the docking station profile), thereby allowing and/ordisallowing one or more electrical signal flow paths between the COM 108and the docking station 200 (e.g., the third microcontroller 112, thedock peripherals 114, etc.) via the second microcontroller 106. Uponestablishing one or more electrical signal flow paths via the secondmicrocontroller 106, the COM 108 may communicate an electrical signal(e.g., a data signal) to/from the docking station 200 via the electricalsignal flow paths enabled by the second microcontroller 106.

In an alternative embodiment, as shown in FIG. 9, the docking station200 may comprise the third microcontroller 112 in electrical signalcommunication with a docking station COM 109, a fourth microcontroller116, and one or more dock peripheral modules 114 (e.g., one or more userinterface modules, one or more I/O modules, etc.). The fourthmicrocontroller may be in electrical signal communication with thedocking station COM 109 and the dock peripheral modules 114. In such anembodiment, the RMCD 100 may be physically and/or electrically coupledto the docking station 200, for example, the housing of the RMCD 100 maybe supported by the docking station 200 and the RMCD 100 may be inelectrical signal communication with the docking station 200 via adocking module 110 e. The first microcontroller 104 and/or the secondmicrocontroller 106 may interrogate the docking station 200 (e.g., thethird microcontroller 112, the fourth microcontroller 116, the dockingstation COM 109, and/or the dock peripherals 114) to generate ordetermine a docking station profile based on the docking station 200,similar to previously disclosed. In the embodiment of FIG. 9, the secondmicrocontroller 106 comprises a matrix switch and may configure and/orreconfigure one or more electrical signal flow paths (e.g., viaswitching one or more electronically switchable gates), thereby allowingand/or disallowing one or more electrical signal flow paths between theCOM 108 and the docking station 200 (e.g., the third microcontroller112, the fourth microcontroller 116, the docking station COM 109, thedock peripherals 114, etc.) via the second microcontroller 106.Additionally or alternatively, one or more I/O ports of the secondmicrocontroller 106 may be configured and/or reconfigured one or moreelectrical signal flow paths dependent on the docking station 200coupled to the RMCD 100 (e.g., based on the docking station profile),thereby allowing and/or disallowing one or more electrical signal flowpaths between the COM 108 and the docking station 200 (e.g., the thirdmicrocontroller 112, the fourth microcontroller 116, the docking stationCOM 109, the dock peripherals 114, etc.) via the second microcontroller106. Upon establishing one or more electrical signal flow paths via thesecond microcontroller 106, the COM 108 may communicate an electricalsignal (e.g., a data signal) to/from the docking station 200 via theelectrical signal flow paths enabled by the second microcontroller 106.

In an embodiment, a computing device, such as the RMCD 100, a computingsystem comprising a RMCD, such as RMCD 100, a computing deviceconfiguring method employing such a computing device, such as RMCD 100,or combinations thereof may be advantageously employed to allowmanufacturer, a reseller, or an end-user to configure and/or reconfigurethe RMCD for one or more applications, as needed. In an embodiment, aspreviously disclosed, a RMCD allows a user to configure the RMCD for afirst application (e.g., comprising a first set of a COM, peripheralmodules, etc.) and then reconfigure the RMCD for one or more subsequentapplications (e.g., comprising a second set of a COM, peripheralmodules, etc.). Conventional computing device may be limited and/orunable to support a broad range of applications, COMs, and/or peripheralmodules. As such, the RMDC may be suitably employed in a variety ofapplications and may support a variety of COMs and peripheral modulesusing a common platform. Additionally, such an RMDC may reduce cost,which may be typically unachievable for similar low volume customdevices.

Of course, a person skilled in the art would, upon a carefulconsideration of the above description of representative embodiments ofthe disclosure, readily appreciate that many modifications, additions,substitutions, deletions, and other changes may be made to the specificembodiments, and such changes are contemplated by the principles of thisdisclosure. Accordingly, the foregoing detailed description is to beclearly understood as being given by way of illustration and exampleonly, the spirit and scope of the invention being limited solely by theappended claims and their equivalents.

ADDITIONAL DISCLOSURE

The following are non-limiting, specific embodiments in accordance withthe present disclosure:

A first embodiment, which is a configurable computing device comprising:

-   -   a housing;    -   a printed circuit board (PCB) disposed within the housing;    -   a first microcontroller and a second microcontroller each        coupled to the PCB, wherein the first microcontroller and the        second microcontroller are in electrical signal communication        with each other;    -   a computer-on-module (COM) coupled to the PCB, wherein the COM        is in electrical signal communication with the first        microcontroller and the second microcontroller; and    -   one or more peripheral modules coupled to the PCB,        -   wherein, the peripheral modules are each in electrical            signal communication with the first microcontroller; and        -   wherein, the peripheral modules are each in electrical            signal communication with the COM via the second            microcontroller.

A second embodiment, which is the configurable computing device of thefirst embodiment, wherein the second microcontroller comprises aplurality of programmable input/output ports.

A third embodiment, which is the configurable computing device of anyone of the first embodiment through the second embodiment, wherein thesecond microcontroller is in electrical signal communication with aplurality of electronic switches.

A fourth embodiment, which is the configurable computing device of anyone of the first embodiment through the third embodiment, wherein theCOM is an x86 platform or an ARM platform.

A fifth embodiment, which is the configurable computing device of anyone of the first embodiment through the fourth embodiment, wherein theperipheral modules comprises a user interface (UI) module.

A sixth embodiment, which is the configurable computing device of anyone of the first embodiment through the fifth embodiment, wherein theperipheral modules comprises an input output (IO) module.

A seventh embodiment, which is the configurable computing device of anyone of the first embodiment through the sixth embodiment, wherein theperipheral modules comprises a display screen.

An eighth embodiment, which is the configurable computing device of anyone of the first embodiment through the seventh embodiment, wherein theperipheral modules comprise a touch screen.

A ninth embodiment, which is the configurable computing device of anyone of the first embodiment through the eighth embodiment, wherein thedevice is configured to be hand-held.

A tenth embodiment, which is the configurable computing device of anyone of the first embodiment through the ninth embodiment, wherein theperipheral module comprises a docking module.

An eleventh embodiment, which is the configurable computing device ofany one of the first embodiment through the tenth embodiment, furthercomprising one or more thermal provisions.

A twelfth embodiment, which is a computing device configuring methodcomprising the steps of:

-   -   providing a printed circuit board (PCB) comprising a first        microcontroller and a second microcontroller, wherein the first        microcontroller and the second microcontroller are in electrical        signal communication with each other;    -   installing a computer-on-module (COM) to the PCB, wherein the        COM is electrically coupled to the PCB;    -   interrogating the COM, thereby determining a COM profile;    -   installing one or more peripheral modules to the PCB, wherein        the peripherals are each electrically coupled to the PCB;    -   interrogating the peripheral modules, thereby determining a        peripheral module profile;    -   configuring the second microcontroller,        -   wherein, the second microcontroller is configured dependent            on the COM profile and the peripheral module profile and            provides one or more electrical signal flow paths between            the COM and the peripheral modules; and    -   communicating an electrical signal between the COM and the        peripheral modules via the second microcontroller.

A thirteenth embodiment, which is the computing device configuringmethod of the twelfth embodiment, wherein interrogating the COM isperformed by the first microcontroller.

A fourteenth embodiment, which is the computing device configuringmethod of any one of the twelfth embodiment through the thirteenthembodiment, wherein interrogating the one or more peripheral modules isperformed by the first microcontroller.

A fifteenth embodiment, which is the computing device configuring methodof any one of the twelfth embodiment through the fourteenth embodiment,further comprising the steps of:

-   -   removing the COM from the PCB;    -   installing a second COM to the PCB;    -   interrogating the second COM; and    -   configuring the second microcontroller, wherein the second        microcontroller provides one or more electrical signal flow path        between the second COM and the one or more peripheral modules;    -   communicating an electrical signal between the second COM and        the one or more peripheral modules via the second        microcontroller.

A sixteenth embodiment, which is the computing device configuring methodof any one of the twelfth embodiment through the fifteenth embodiment,further comprising the steps of:

-   -   reconfiguring the peripheral modules coupled to the PCB;    -   interrogating the reconfigured peripheral modules;    -   installing the second microcontroller, wherein the second        microcontroller provides one or more electrical signal flow path        between the COM and the peripheral modules; and    -   communicating an electrical signal between the COM and the        peripheral modules via the second microcontroller.

A seventeenth embodiment, which is the computing device configuringmethod of any one of the twelfth embodiment through the sixteenthembodiment, further comprising the steps of:

-   -   providing a docking station comprising one or more dock        microcontrollers in electrical signal communication with one or        more dock peripheral modules, wherein the peripheral modules are        in electrical signal communication with the dock        microcontrollers;    -   interrogating the docking station;    -   configuring the second microcontroller, wherein the second        microcontroller provides one or more electrical signal flow path        between the COM and the dock peripheral modules; and    -   communicating an electrical signal between the COM and the dock        peripheral modules via the second microcontroller.

An eighteenth embodiment, which is the computing device configuringmethod of any one of the twelfth embodiment through the sixteenthembodiment, further comprising the steps of:

-   -   providing a docking station comprising one or more dock        microcontrollers in electrical signal communication with one or        more dock peripheral modules, wherein the peripheral modules are        in electrical signal communication with the dock        microcontrollers;    -   interrogating the docking station;    -   configuring the second microcontroller, wherein the second        microcontroller provides one or more electrical signal flow path        between the COM and the dock station COM; and    -   communicating an electrical signal between the COM and the        docking station COM via the second microcontroller.

A nineteenth embodiment, which is a mobile computing device comprising:

-   -   a housing comprising a front case, a mid-frame, and a back case,        wherein the front case and the back case are configured to        combine and enclose the mid-frame;    -   a printed circuit board (PCB) coupled to the mid-frame;    -   a first microcontroller and a second microcontroller each        coupled to the PCB, wherein the first microcontroller and the        second microcontroller are in electrical signal communication        with each other;    -   a computer-on-module (COM) coupled to the PCB, wherein the COM        is in electrical signal communication with the first        microcontroller and the second microcontroller; and    -   one or more peripheral modules coupled to the PCB,        -   wherein the peripheral modules are each in electrical signal            communication with the first microcontroller;        -   wherein the peripheral modules are each in electrical signal            communication with the COM via the second microcontroller;            and        -   wherein the peripheral modules comprises a display, one or            more input/output (I/O) ports, a dock module, and one or            more user interfaces.

A twentieth embodiment, which is the mobile computing device of thenineteenth embodiment, further comprising one or more thermal provision.

While embodiments of the invention have been shown and described,modifications thereof can be made by one skilled in the art withoutdeparting from the spirit and teachings of the invention. Theembodiments described herein are exemplary only, and are not intended tobe limiting. Many variations and modifications of the inventiondisclosed herein are possible and are within the scope of the invention.Where numerical ranges or limitations are expressly stated, such expressranges or limitations should be understood to include iterative rangesor limitations of like magnitude falling within the expressly statedranges or limitations (e.g., from about 1 to about 10 includes, 2, 3, 4,etc.; greater than 0.10 includes 0.11, 0.12, 0.13, etc.). For example,whenever a numerical range with a lower limit, Rl, and an upper limit,Ru, is disclosed, any number falling within the range is specificallydisclosed. In particular, the following numbers within the range arespecifically disclosed: R=Rl+k*(Ru−Rl), wherein k is a variable rangingfrom 1 percent to 100 percent with a 1 percent increment, i.e., k is 1percent, 2 percent, 3 percent, 4 percent, 5 percent, . . . 50 percent,51 percent, 52 percent, . . . , 95 percent, 96 percent, 97 percent, 98percent, 99 percent, or 100 percent. Moreover, any numerical rangedefined by two R numbers as defined in the above is also specificallydisclosed. Use of the term “optionally” with respect to any element of aclaim is intended to mean that the subject element is required, oralternatively, is not required. Both alternatives are intended to bewithin the scope of the claim. Use of broader terms such as comprises,includes, having, etc. should be understood to provide support fornarrower terms such as consisting of, consisting essentially of,comprised substantially of, etc.

Accordingly, the scope of protection is not limited by the descriptionset out above but is only limited by the claims which follow, that scopeincluding all equivalents of the subject matter of the claims. Each andevery claim is incorporated into the specification as an embodiment ofthe present invention. Thus, the claims are a further description andare an addition to the embodiments of the present invention. Thediscussion of a reference in the Detailed Description of the Embodimentsis not an admission that it is prior art to the present invention,especially any reference that may have a publication date after thepriority date of this application. The disclosures of all patents,patent applications, and publications cited herein are herebyincorporated by reference, to the extent that they provide exemplary,procedural or other details supplementary to those set forth herein.

What is claimed is:
 1. A computing device configuring method comprisingthe steps of: providing a printed circuit board (PCB) comprising a firstmicrocontroller and a second reconfigurable microcontroller, wherein thefirst microcontroller and the second reconfigurable microcontroller arein electrical signal communication with each other; installing acomputer-on-module (COM) to the PCB, wherein the COM is electricallycoupled to the PCB; interrogating the COM, thereby determining a COMprofile, wherein the COM profile comprises at least one of a deviceconfiguration parameter or a device setting; installing one or moreperipheral modules to the PCB, wherein the peripherals are eachelectrically coupled to the PCB; interrogating the peripheral modules,thereby determining a peripheral module profile, wherein the peripheralmodule profile comprises at least one of a device configurationparameter or a device setting; reconfiguring the second reconfigurablemicrocontroller, wherein, the second reconfigurable microcontroller isreconfigured dependent on the COM profile and the peripheral moduleprofile and provides one or more electrical signal flow paths betweenthe COM and the peripheral modules; and communicating an electricalsignal between the COM and the peripheral modules via the secondreconfigurable microcontroller.
 2. The method of claim 1, whereininterrogating the COM is performed by the first microcontroller.
 3. Themethod of claim 2, wherein interrogating the one or more peripheralmodules is performed by the first microcontroller.
 4. The method ofclaim 1, further comprising the steps of: removing the COM from the PCB;installing a second COM to the PCB; interrogating the second COM;reconfiguring the second reconfigurable microcontroller, wherein thesecond reconfigurable microcontroller provides one or more electricalsignal flow path between the second COM and the one or more peripheralmodules; and communicating an electrical signal between the second COMand the one or more peripheral modules via the second reconfigurablemicrocontroller.
 5. The method of claim 1, further comprising the stepsof: reconfiguring the peripheral modules coupled to the PCB;interrogating the reconfigured peripheral modules; installing the secondreconfigurable microcontroller, wherein the second reconfigurablemicrocontroller provides one or more electrical signal flow path betweenthe COM and the peripheral modules; and communicating an electricalsignal between the COM and the peripheral modules via the secondreconfigurable microcontroller.
 6. The method of claim 1 furthercomprising the steps of: providing a docking station comprising one ormore dock microcontrollers in electrical signal communication with oneor more dock peripheral modules, wherein the peripheral modules are inelectrical signal communication with the dock microcontrollers;interrogating the docking station; reconfiguring the secondreconfigurable microcontroller, wherein the second reconfigurablemicrocontroller provides one or more electrical signal flow path betweenthe COM and the dock peripheral modules; and communicating an electricalsignal between the COM and the dock peripheral modules via the secondreconfigurable microcontroller.
 7. The method of claim 1 furthercomprising the steps of: providing a docking station comprising one ormore dock microcontrollers in electrical signal communication with oneor more dock peripheral modules, wherein the peripheral modules are inelectrical signal communication with the dock microcontrollers;interrogating the docking station; reconfiguring the secondreconfigurable microcontroller, wherein the second reconfigurablemicrocontroller provides one or more electrical signal flow path betweenthe COM and the dock station COM; and communicating an electrical signalbetween the COM and the docking station COM via the secondreconfigurable microcontroller.
 8. A mobile computing device comprising:a housing comprising a front case, a mid-frame, and a back case, whereinthe front case and the back case are configured to combine and enclosethe mid-frame; a printed circuit board (PCB) coupled to the mid-frame; afirst microcontroller and a second reconfigurable microcontroller eachcoupled to the PCB, wherein the first microcontroller and the secondreconfigurable microcontroller are in electrical signal communicationwith each other; a computer-on-module (COM) coupled to the PCB, whereinthe COM is in electrical signal communication with the firstmicrocontroller and the second reconfigurable microcontroller; and oneor more peripheral modules coupled to the PCB, wherein the peripheralmodules are each in electrical signal communication with the firstmicrocontroller; wherein the peripheral modules are each in electricalsignal communication with the COM via the second reconfigurablemicrocontroller; wherein the peripheral modules comprises a display, oneor more input/output (I/O) ports, a dock module, and one or more userinterfaces, wherein the second reconfigurable microcontroller isreconfigured based on a COM profile and a peripheral module profile andprovides one or more electrical signal flow paths between the COM andthe peripheral modules, wherein the COM profile comprises at least oneof a device configuration parameter or a device setting, and wherein theperipheral module profile comprises at least one of a deviceconfiguration parameter or a device setting.
 9. The mobile computingdevice of claim 8, further comprising one or more thermal provision.